Intellectual Property India Publishes Patent Application for Method For Piecing A Fibre Bundle End To A Bobbin-Side Yarn End At A Spinning Station Of An Air-Jet Spinning Machine Having A Spinning Nozzle And Air-Jet Spinning Machine

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514118852 A) filed by Rieter AG on November 28, 2025, for Method For Piecing A Fibre Bundle End To A Bobbin-Side Yarn End At A Spinning Station Of An Air-Jet Spinning Machine Having A Spinning Nozzle And Air-Jet Spinning Machine. Inventors include Brenner, Hannah; Straub, Oliver; Funke, Simon-Moritz; and Hillerbrand, Markus. The application for the patent was published on August 28, 2026, under issue n...


Intellectual Property India Publishes Patent Application for Display Device

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514118896 A) filed by Lg Display Co. , Ltd. on November 28, 2025, for Display Device. Inventors include Hyunjik Bae; and Minho Lee --. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: A display device can include a first sub pixel and a second sub pixel disposed on a substrate and configured to emit a same color of light, a first light emitting diode ...


Intellectual Property India Publishes Patent Application for Method For Operating A Textile Machine For Producing Cross-Wound Bobbins And Textile Machine For Producing Cross-Wound Bobbins

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514118908 A) filed by Rieter AG on November 28, 2025, for Method For Operating A Textile Machine For Producing Cross-Wound Bobbins And Textile Machine For Producing Cross-Wound Bobbins. Inventors include Maleck, Mario; Bergmann, Roland; and Stephan, Adalbert. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: The invention relates to a method for operat...


Intellectual Property India Publishes Patent Application for Contact Switch, Safety Door And Elevator System

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514110912 A) filed by Otis Elevator Company on November 13, 2025, for Contact Switch, Safety Door And Elevator System. Inventors include Hu, Jie; Zhang, Hua; Li, Shan; Wang, Haibo; and Li, Guowei. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: The present disclosure provides a contact switch, a safety door and an elevator system. The contact switch ...


Intellectual Property India Publishes Patent Application for Light Emitting Diode Display Device And Display Panel

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514110928 A) filed by Lg Display Co. , Ltd. on November 13, 2025, for Light Emitting Diode Display Device And Display Panel. Inventors include Kwak Do-Hun; and Lee Sung-Jin --. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: Light emitting diode display device (200, 300, 400) and a display panel included, comprises substrate (202, 302, 402) including...


Intellectual Property India Publishes Patent Application for Light Emitting Display Device

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514110929 A) filed by Lg Display Co. , Ltd. on November 13, 2025, for Light Emitting Display Device. Inventors include Yang Heejung; Kim Minjoo; Lee Youngwook; Kim Jungmin --; and Lee Hoseung. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: A light emitting display device is provided. The light emitting display device incldues a substrate (110) inclu...


Intellectual Property India Publishes Patent Application for Assembly Substrate

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514110939 A) filed by Lg Display Co. , Ltd. on November 13, 2025, for Assembly Substrate. Inventors include Yang Kiyong; Kwon Kyuoh --; Lee Seungjun; and Han Myungsoo. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: Provided is assembly substrate (10) for assembling plurality of light emitting diodes. The assembly substrate (10) includes assembly bas...


Intellectual Property India Publishes Patent Application for “heat Sink Structure And Semiconductor Package Combined With The Heat Sink”

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514106135 A) filed by Jmj Korea Co. , Ltd. on November 03, 2025, for “heat Sink Structure And Semiconductor Package Combined With The Heat Sink”. Inventors include Choi, Yunhwa; Choi, Jeongwoo; and Lee, Junho --. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: ABSTRACT HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE COMBINED WITH THE HEAT SINK Provided...


Intellectual Property India Publishes Patent Application for Electronic Device With A Triangular-Shaped Frequency Dithering Profile

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514106857 A) filed by Apple Inc. on November 04, 2025, for Electronic Device With A Triangular-Shaped Frequency Dithering Profile. Inventors include Zhou, Rui; Zhu, Guangqi; Pavicich, Douglas M; Russell, Antoin J; Efanov, Andrew A; Sen, Indranil S; Walia, Manjit S Number; Sjoeroos, Jukka-Pekka J; and Colburn, Matthew. The application for the patent was published on August 28, 2026, under issue no. 35/2...


Intellectual Property India Publishes Patent Application for Semiconductor Package And Method Of Manufacturing The Same

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514106937 A) filed by Samsung Electronics Co. , Ltd. on November 04, 2025, for Semiconductor Package And Method Of Manufacturing The Same. Inventor includes Young Kun Jee --. The application for the patent was published on August 28, 2026, under issue no. 35/2026. Abstract: A semiconductor package a includes a first semiconductor chip, a plurality of second semiconductor chips stacked on the first sem...