MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514106135 A) filed by Jmj Korea Co. , Ltd. on November 03, 2025, for “heat Sink Structure And Semiconductor Package Combined With The Heat Sink”.
Inventors include Choi, Yunhwa; Choi, Jeongwoo; and Lee, Junho --.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: ABSTRACT HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE COMBINED WITH THE HEAT SINK Provided is a heat sink structure and a semiconductor package combined with the heat sink, and more particularly, to a heat sink structure having an improved structure to efficiently release heat generated from a semiconductor package through various surfaces of the semiconductor package and a semiconductor package combined with the heat sink structure. The heat sink structure according to an embodiment of the present invention includes two or more heat sinks that contact a first surface and a second surface of a semiconductor package to transmit heat. Each heat sink may include a first radiation unit including a first area having a flat surface contacting one surface of the semiconductor package and a third area having a length corresponding to the first area at the opposite sides of the first area; and a second radiation unit including a second area extended from the first area along a longitudinal direction of the semiconductor package and a fourth area having a length corresponding to the second area at the opposite sides of the second area, wherein the second area through the fourth area may include a plurality of radiation fins to expand a surface area contacting cooling air.
Disclaimer: Curated by HT Syndication.
