Intellectual Property India Publishes Patent Application for Systems And Methods For Non-Separable Transforms For Inter Prediction In Video Coding

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054715 A) filed by Guangdong Oppo Mobile Telecommunications Corp. on April 29, 2026, for Systems And Methods For Non-Separable Transforms For Inter Prediction In Video Coding. Inventors include Gan, Jonathan; Yu, Yue; and Yu, Haoping. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: Methods and systems for video processing are provided. In some embod...


Intellectual Property India Publishes Patent Application for Quick Coupling Assembly With Connection Locking Piston And Low Loss Of Load

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054717 A) filed by Stucchi S. P. A. on April 29, 2026, for Quick Coupling Assembly With Connection Locking Piston And Low Loss Of Load. Inventor includes Tivelli, Sergio. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: A quick coupling assembly (1) is described suitable for connecting hydraulic lines under pressure, comprising a female coupling (2) ...


Intellectual Property India Publishes Patent Application for Switch To Rrc Connected State

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054883 A) filed by Nokia Technologies Oy on April 29, 2026, for Switch To Rrc Connected State. Inventors include Godin, Philippe; Turtinen, Samuli Heikki; Koskinen, Jussi-Pekka; and Khlass, Ahlem. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: A method includes receiving, by a first apparatus, a first message from a second apparatus, the first mess...


Intellectual Property India Publishes Patent Application for Timely Real-Time Aiml Inference And Troubleshooting In Telecommunication

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054884 A) filed by Nokia Technologies Oy on April 29, 2026, for Timely Real-Time Aiml Inference And Troubleshooting In Telecommunication. Inventors include Gharouni, Afsaneh; Gajic, Borislava; Mwanje, Stephen; and Sun, Shu Qiang. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: Embodiments of the present disclosure relate to devices, methods, apparat...


Intellectual Property India Publishes Patent Application for Binders For Secondary Battery Electrodes

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054890 A) filed by Syensqo Specialty Polymers Italy S. P. A. on April 29, 2026, for Binders For Secondary Battery Electrodes. Inventors include Petrizza, Luca; Abusleme, Julio A.; Merlini, Luca; Fiore, Michele; Brusseau, Sgolne; and Oriani, Andrea Vittorio. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: The present invention pertains to vinylidene ...


Intellectual Property India Publishes Patent Application for Binders For Secondary Battery Electrodes

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054891 A) filed by Syensqo Specialty Polymers Italy S. P. A. on April 29, 2026, for Binders For Secondary Battery Electrodes. Inventors include Petrizza, Luca; Abusleme, Julio; Brusseau, Sgolne; Fiore, Michele; Merlini, Luca; and Oriani, Andrea Vittorio. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: The present invention pertains to vinylidene flu...


Intellectual Property India Publishes Patent Application for Solvent Screening Method

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054893 A) filed by Solve Chemistry Ltd; Basf Se; and Imperial College Innovations Limited on April 29, 2026, for Solvent Screening Method. Inventors include Schrecker, Linden Robert Mccabe; Folch, Jose; Hellgardt, Klaus; Hii, King Kuok; Dickhaut, Joachim; Holtze, Christian; and Wieja, Andy. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: There is pr...


Intellectual Property India Publishes Patent Application for Tgfßrii Extracellular Region Variants And Uses Thereof

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054895 A) filed by Agenus Inc. on April 29, 2026, for Tgfßrii Extracellular Region Variants And Uses Thereof. Inventors include Wensley, Beth; and Morin, Benjamin. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: Provided herein are polypeptides comprising variant human TGFßRII extracellular regions, and fusions of the same with antibody molecules. A...


Intellectual Property India Publishes Patent Application for Anti-Fap Antibodies And Methods Of Use Thereof

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617054911 A) filed by Agenus Inc. on April 29, 2026, for Anti-Fap Antibodies And Methods Of Use Thereof. Inventors include Venkatraman, Vignesh; Iyer, Priyadarshini; Briend, Emmanuel Cyrille Pascal; Ignatovich, Olga; Pravin, John; Wensley, Beth; and Chand, Dhan Sidhartha. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: Provided are antibodies that spec...


Intellectual Property India Publishes Patent Application for Multilayer Ceramic Electronic Component And Method For Manufacturing Multilayer Ceramic Electronic Component

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617055311 A) filed by Murata Manufacturing Co. , Ltd. on April 30, 2026, for Multilayer Ceramic Electronic Component And Method For Manufacturing Multilayer Ceramic Electronic Component. Inventors include Uchida, Hiroyuki; and Miyazaki, Tomochika. The application for the patent was published on June 05, 2026, under issue no. 23/2026. Abstract: Provided is a multilayer ceramic electronic component capa...