MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617076126 A) filed by Hcp Sense Gmbh on June 19, 2026, for Apparatus And Method For Measuring Impedance Of Tribological Contacts. Inventors include Riehl, David; Oster, Timo; Martin, Georg; Schirra, Tobias; Abdallah, Ali; and Hofmann, Klaus. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: An apparatus for measuring an impedance (Z) along a current path...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617073304 A) filed by Lg Electronics Inc. on June 12, 2026, for Point Cloud Data Transmission Device, Point Cloud Data Transmission Method, Point Cloud Data Reception Device, And Point Cloud Data Reception Method. Inventor includes Oh, Hyunmook. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: A decoding method according to embodiments may comprise the ...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617073356 A) filed by Ksb Se & Co. Kgaa on June 12, 2026, for Elliptical, Eccentric Annular Space. Inventors include Hafner, Frank; and Hankeln, Fabian. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: The invention relates to a centrifugal pump having a housing (1) in sheet metal construction, wherein the housing (1) is designed as a deep-drawn part. T...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617075781 A) filed by Qualcomm Incorporated on June 18, 2026, for Security Aspects For Layer 1 Or Layer 2 Triggered Mobility. Inventors include Akl, Naeem; Purkayastha, Punyaslok; Lee, Soo Bum; and Kadiri, Prasad Reddy. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: Some wireless communication systems perform handover procedures to transfer user equip...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617076005 A) filed by Siempelkamp Maschinen- Und Anlagenbau Gmbh on June 19, 2026, for Method For Producing A Material Panel. Inventor includes Hneke, Jrg Heinz. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: The invention relates to a method for producing a material panel, in particular a wooden material panel, from a material, comprising the followi...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617075487 A) filed by Nippon Steel Corporation on June 18, 2026, for Steel Sheet. Inventors include Hironaka, Satoshi; Nakano, Katsuya; and Nagano, Mai. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: Provided is a steel sheet that is characterized by having a prescribed chemical composition and having a metal structure which contains, in area%, 75% to...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617075490 A) filed by Mitsui Chemicals, Inc. on June 18, 2026, for Method For Manufacturing Conductive Member, And Conductive Member. Inventors include Tsugane, Yasuhito; and Washio, Isao. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: This method for manufacturing a conductive member includes: having a powder adhered to the surface of a metal member ...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617075532 A) filed by Samsung Electronics Co. , Ltd. on June 18, 2026, for Electronic Device Including Molding Portion. Inventors include Kim, Junyoung; Choi, Byungchul; and Kim, Ilyoung. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: An electronic device according to an embodiment disclosed herein comprises: a housing; a display disposed in the housi...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617075570 A) filed by Toyo Engineering Corporation on June 18, 2026, for Urea Production Apparatus, Method For Improving Urea Production Apparatus, And Urea Production Method. Inventors include Kawata Shogo; Yanagawa Takahiro; and Kojima Yasuhiko. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: A urea production apparatus (10) comprises: a first evapor...
MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617075589 A) filed by Abu Dhabi Polymers Co. Ltd Borouge - Sole; and Borealis Gmbh on June 18, 2026, for Polyethylene Film For Soil Solarisation. Inventors include Tajane, Vilas; Teo, Aster; Pandya, Rakesh; Thakor, Pavankumar; and Puri, Sandeep. The application for the patent was published on July 31, 2026, under issue no. 31/2026. Abstract: The present invention relates to a multilayer polyethylene f...