MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617076005 A) filed by Siempelkamp Maschinen- Und Anlagenbau Gmbh on June 19, 2026, for Method For Producing A Material Panel.
Inventor includes Hneke, Jrg Heinz.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The invention relates to a method for producing a material panel, in particular a wooden material panel, from a material, comprising the following steps: a) providing at least one layer of a material, in particular a material which contains wood chips and/or wood fibres, b) providing a press (1, 1') comprising: - a top pressing device (1A, 1A1) and a bottom pressing device (IB, 1B1), between which a gap (5) is formed for receiving the material, - wherein the top pressing device (1A, 1A1) and/or the bottom pressing device (IB, 1B1) has hydraulic pressing cylinders (12) which can change the gap width (8) between the top pressing device (1A, 1A1) and the bottom pressing device (IB, 1B1) and can transfer pressing forces onto the material, and - wherein the top pressing device (1A, 1A1) and/or the bottom pressing device (1B, 1B') has a heating device, in particular a heating plate (14A, 14B), which can at least indirectly transfer heat to the material, c) pressing the material in the gap (5) between the top pressing device (1A, 1A1) and the bottom pressing device (IB, 1B1), d) heating the material in the gap (5) between the top pressing device (1A, 1A1) and the bottom pressing device (IB, 1B1), - wherein steps c) and d) take place at least partially simultaneously, characterised in that during step d) the temperature (T) in the material is increased to at least 130°C, in particular at least 150°C, preferably at least 180°C.
Disclaimer: Curated by HT Syndication.
