MUMBAI, India, Sept. 7 -- Intellectual Property India has published a patent application (202617082068 A) filed by Samsung Electronics Co. , Ltd. on July 03, 2026, for Wireless Module And Electronic Device Comprising Same.
Inventors include Baek, Kwanghyun; Kim, Youngsub; Kim, Jinhoon; Park, Chunmyung; Yeom, Hyunho; Lee, Jungyub; Jung, Sohyeon; and Ha, Dohyuk.
The application for the patent was published on September 04, 2026, under issue no. 36/2026.
Abstract: Provided is a wireless module of an electronic device for performing communication with a terminal. The wireless module may include: a first substrate; a radio frequency (RF) processing circuit electrically connected to the first substrate; a second substrate including a plurality of layers; a plurality of radiators which are arranged in at least one layer among the layers of the second substrate; and a grid array including a plurality of solder elements coupled to a first surface of the first substrate and a first surface of the second substrate. The first surface of the second substrate may include a connection region to which the plurality of solder elements are coupled and at least one corner region to which no solder element is coupled. The second substrate may include a copper portion arranged on a layer which differs from the at least one layer among the layers of the second substrate and corresponds to the first surface. The copper portion may include a portion partially formed in the at least one corner region.
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