MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202621109328 A) filed by Hetalben Hirenkumar Savaliya; and Hirenkumar Vallabhbhai Savaliya on September 11, 2026, for Water-Cooled Grinding And Lapping Machine For Large-Diameter Polycrystalline Diamond Wafers.
Inventor includes Hirenkumar Vallabhbhai Savaliya.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A water-cooled machine (1) and process are disclosed for precision grinding and fine lapping of a polycrystalline diamond wafer (57) having a diameter up to 600 mm. The machine (1) includes a spindle assembly (18) carrying a vitrified diamond wheel (26), a force-controlled Z-axis assembly (32), a radially movable X-axis assembly (38) and a rotary-table assembly (42) carrying a multi-zone vacuum chuck (46). A water-spray system (58) provides separate wheel cooling, contact-zone cooling and wafer washing, while a coolant-treatment system (65) filters and recirculates process water. A metrology system (80) maps wafer thickness and a dressing assembly (29) conditions the diamond wheel (26). Coordinated wheel rotation, wafer counter-rotation, radial oscillation and axial-force control are applied during rough grinding, intermediate grinding, fine grinding and optional low-pressure fine lapping to facilitate controlled material removal, reduced thickness variation, thermal management and debris evacuation. Wafer surface roughness is verified by atomic-force microscopy.
Disclaimer: Curated by HT Syndication.
