MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202641081664 A) filed by Mr. Harish Panjagala; and Dr. Diwakar Reddy Vanimireddy on July 02, 2026, for Walnut Shell Powder Filled Areca-Kenaf Fiber Epoxy Composite Laminate.
Inventors include Mr. Harish Panjagala; and Dr. Diwakar Reddy Vanimireddy.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: The present invention relates to a walnut shell powder filled areca-kenaf fiber reinforced epoxy composite laminate. The laminate comprises areca fiber mats, kenaf fiber mats, walnut shell powder and an epoxy resin matrix. In a preferred embodiment, the fiber mats are arranged in a KAAK layup sequence, wherein kenaf fiber mats form the outer layers and areca fiber mats form the inner layers. Walnut shell powder is dispersed in the epoxy matrix, preferably at about 7.5 wt%, to reduce void content, improve fiber- matrix adhesion and enhance mechanical properties. The composite preferably comprises about 10 wt% areca fiber, about 10 wt% kenaf fiber, about 7.5 wt% walnut shell powder and about 72.5 wt% epoxy matrix. The laminate provides improved tensile strength, flexural strength, hardness and thermal insulation. The composite is suitable for automotive interior panels, door trims, partition boards, cladding, building panels and insulation components. (Accompanied Figure No. 1-11)
Disclaimer: Curated by HT Syndication.
