MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202617055038 A) filed by Miralex Technologies on April 30, 2026, for Wall Assembly With Improved Thermal Insulation Properties.
Inventor includes Coelho, Jean-Claude.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: A wall including a thermal chamber assembly having a radiant panel layer, a thermal generation system connected to the radiant panel layer, a first insulation layer connected to the radiant panel layer opposite the thermal generation system, and a radiant barrier layer connected to the first insulation layer between the first insulation layer and the radiant panel layer. The wall also includes a ventilated cavity assembly, connected to the thermal chamber assembly, having a second insulation layer connected to the first insulation layer opposite the radiant barrier layer; a gas barrier layer connected to the second insulation layer opposite the radiant barrier layer to establish a first gas layer between the second insulation layer and the gas barrier layer; and an exterior layer connected to the gas barrier layer opposite the second insulation layer to establish a second gas layer between the gas barrier layer and the exterior layer.
Disclaimer: Curated by HT Syndication.
