MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202637092141 A) filed by Daicel Corporation on July 29, 2026, for Void Occurrence Prediction Method, Void Reduction Method, And Computer-Readable Recording Medium.
Inventors include Aoki, Gen; Hamano, Yuhsuke; Miyazaki, Akihiro; and Amano, Yuta.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A void occurrence prediction method comprises: using formula (I) to acquire, from a viscosity measure result, temperature dependency data on Young's modulus in a molten state; generating an analysis model of an injection molded article; acquiring a temperature distribution and a pressure distribution of the analysis model in a molding step; calculating a temperature distribution of the analysis model in a cooling process after mold release; calculating an elastic modulus distribution and a temperature load distribution of the analysis model on the basis of the temperature dependency data on Young's modulus, the temperature distribution, and the pressure distribution; performing structural analysis using the elastic modulus distribution and the temperature load distribution to calculate distortion that occurs to the analysis model; and using the distortion to predict at least one of the amount of a void and the position of the occurrence of the void. (I): E=?1?+?2; ?: viscosity; E: Young's modulus; ?1, ?2: constant
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