MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088703 A) filed by Qualcomm Incorporated on July 21, 2026, for Video Headsets With Fluid-Based Cooling Systems And Related Methods.
Inventors include Wang, Peng; Yu, Youmin; and Nikfar, Nader.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: In a video headset, a video display inside an extended reality (XR) device is controlled by electronic circuits that generate heat while executing software applications for displaying content on the video display. The XR device includes heat dissipation technology to dissipate heat generated by the electronic circuits. The video headset includes a fluid-based cooling system comprising a closed loop conduit through which fluid moves from the XR device in the frontal portion of the harness to a thermal control mechanism in a rear portion of the harness, adjacent to the back of a user's head and then back to the XR device. In this regard, heat dissipation elements may be relocated from the XR device to the thermal control mechanism. to redirect heat to the rear portion, shift some of the noise and vibration to the rear portion and improve the weight distribution of the video headset.
Disclaimer: Curated by HT Syndication.
