MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202647094713 A) filed by Qualcomm Incorporated on August 05, 2026, for Vertically Coupled Inductors In Substrate.
Inventors include Liu, Kai; Lan, Je-Hsiung; and Kim, Jonghae.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Disclosed are devices that incorporate vertically coupled inductors in a substrate. The device includes an input inductor and one or more output inductors. Energy from the input inductor is transferred to the output inductors through magnetic coupling. Input and output inductors are formed as three-dimensional loops within a substrate so that there are vertical couplings between the input and the output inductors.
Disclaimer: Curated by HT Syndication.
