MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617071138 A) filed by Repligen Corporation on June 08, 2026, for Universal Modular Pressure Sensors And Fittings Therefor.
Inventor includes Pavlik, Rudolf.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A system for monitoring pressure in a bioprocessing system includes a binder connector or industrial connector including a plurality of electrically conductive pins disposed therethrough. A sensor cap has an opening for receiving a distal portion of the binder connector. A sensor spacer has an upper end engageable with a surface of the sensor cap. The sensor spacer has an opening for receiving wire leads coupled to the electrically conductive pina. A sensor has a printed circuit board (PCB) disposed thereon. The PCB includes a plurality of wire solder points for electrically coupling to the wire leads. A sensor insert having a sealing portion receives the sensor therein. A sensor housing has a seat portion for receiving the sealing portion thereon and an upper flange portion for coupling to the sensor cap.
Disclaimer: Curated by HT Syndication.
