MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647066310 A) filed by Henkel AG & Co. Kgaa on May 26, 2026, for Two Component (2k) Curable And Debondable Adhesive Composition.
Inventors include Stapf, Stefanie; Lieske, Alexandra; Kamm, Thomas; and Zhu, Bin.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The present invention is directed to an adhesive composition having a fast cure which can be debonded from particular substrates to which it is applied. More particularly, the present invention is directed to a two-part (2K) fast curable and debondable adhesive composition which has particular utility in the bonding of electronic components.
Disclaimer: Curated by HT Syndication.
