MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202641072842 A) filed by Vellore Institute Of Technology on June 12, 2026, for Topology-Excised Void Form Lightweight Structural Panel.
Inventors include Sharan Chandran M; Dr John Rajan; Tejas Dandgaval; Vidhyachaara N Rs; and Anushka Gupta.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: ABSTRACT TOPOLOGY-EXCISED VOID FORM LIGHTWEIGHT STRUCTURAL PANEL A topology-excised void form lightweight structural panel (10) comprises an outer dimensional envelope (12) defining an external boundary of the panel (10), the outer dimensional envelope (12) being maintained as an invariant across design iterations. A central aperture (14) is disposed at a geometric centroid of the panel (10). An interior material field (18) is disposed within the outer dimensional envelope (12). A plurality of filleted excisional voids (16) are disposed within the interior material field (18), each filleted excisional void (16) being circumscribed by a filleted perimetric boundary (20). Geometric coordinates, diametric dimensionality, and fillet radii of each filleted excisional void (16) are determined through iterative finite element stress analysis of stress distributions under a loading condition.
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