MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202611104130 A) filed by Chandigarh University on August 29, 2026, for Three-Dimensional Printed Scaffold For Post-Printing Microbial Colonization.
Inventors include Jaisleen Kaur; Komalpreet Kaur; Vanshika Dhanwal; Ritesh Sanga; Nitish Kumar Sharma; Swedika Sharma; Naveen Kumar; and Sangeeta.
The application for the patent was published on October 09, 2026, under issue no. 41/2026.
Abstract: The present invention relates to a three-dimensional printed scaffold configured for post-printing microbial colonization. The scaffold comprises a biocompatible material and surface pores and internal channels configured to support attachment, penetration, colonization and growth of selected microbial strains. The scaffold is three-dimensionally printed without incorporating living microbial cells during the printing process and is subsequently stabilized by drying, sterilization or pre- treatment. Selected or engineered microbial strains are subsequently introduced onto the stabilized scaffold by immersion and surface application and incubated to establish microbial colonization on the surface and within the pores and internal channels. The resulting functional microbial scaffold provides microbial activities including biosensing, pollutant degradation, environmental signaling and nutrient cycling. The invention separates scaffold fabrication from microbial introduction, thereby providing a flexible platform for post-printing microbial colonization and functionalization.
Disclaimer: Curated by HT Syndication.
