MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202611102851 A) filed by Sharda University on August 26, 2026, for Thiophene-Imine Functionalized Borosiloxane Hybrid Polymer, Method For Preparation Thereof, And Adhesive Composition Comprising Same.
Inventors include Narender Singh; and Sonia Khanna.
The application for the patent was published on October 09, 2026, under issue no. 41/2026.
Abstract: The present invention relates to a thiophene-imine functionalized borosiloxane hybrid polymer (100), an adhesive composition (200) comprising the same, and methods for preparation and use thereof. The hybrid polymer (100) addresses the need for an organic-inorganic material combining thiophene and imine functionalities with silicon- and boron-containing functionalities. The hybrid polymer (100) is prepared by reacting 3-thienaldehyde (102) with 3-aminopropyltriethoxysilane (APTES) (104) to form a Schiff-base intermediate (106), followed by reaction of the Schiff-base intermediate (106) with boric acid (108) to form a borosiloxane network comprising Si–O–Si and Si–O–B linkages. The resulting hybrid polymer (100) is combined with an epoxy resin (202) to form a curable adhesive composition (200). The adhesive composition (200) may be applied between substrate surfaces and cured to form a bonded article. The hybrid polymer (100) provides an organic-inorganic hybrid architecture suitable for epoxy-based adhesive applications and provides thermal and adhesive performance characteristics demonstrated by the disclosed embodiments.
Disclaimer: Curated by HT Syndication.
