MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202517134607 A) filed by Caihong Display Devices Co. , Ltd. on December 31, 2025, for Thickness Control Cooling Air Device For Forming Substrate Glass By Overflow Process, And Method For Using Same.
Inventors include Hu, Weidong; Ren, Yongjing; Zhang, Zhijun; and Luo, Ting.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present application belongs to the technical field of glass manufacturing. Disclosed are a thickness control cooling air device for forming substrate glass by an overflow process, and a method for using same. The device comprises two thermal equalization boxes and a cooling mechanism which are arranged at the bottom of an overflow brick, wherein the thermal equalization boxes are respectively located on two sides of substrate glass, and the cooling mechanism comprises a plurality of first cooling air pipes, a second cooling air pipe and a fixing assembly; each first cooling air pipe is arranged outside the thermal equalization boxes, and an air inlet of the first cooling air pipe is configured to communicate with cooling air; the second cooling air pipe extends through the thermal equalization boxes, an air outlet of the second cooling air pipe is arranged close to the substrate glass, and the second cooling air pipe is made of a high-temperature-resistant material; and the first cooling air pipes and the second cooling air pipe are in communication with each other by means of the fixing assembly. The present application can solve the problems of repeated thickness adjustment of a glass plate, low efficiency and poor accuracy caused by the failure to accurately adjust the relative position between the cooling air and the glass plate due to susceptibility to deformation of thickness control air pipes after long-term use.
Disclaimer: Curated by HT Syndication.
