MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202641111050 A) filed by Indian Institute Of Technology Hyderabad on September 16, 2026, for Thermosetting Bioadhesive Composition And A Method Of Preparation Thereof.
Inventors include Mansi Dixit; and Falguni Pati.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: ABSTRACT THERMOSETTING BIOADHESIVE COMPOSITION AND A METHOD OF PREPARATION THEREOF The present invention relates to a thermosetting bioadhesive composition comprising decellularized extracellular matrix (dECM) conjugated with ureidopyrimidinone (UPy) supramolecular units. The composition remains flowable above 45°C and undergoes irreversible sol-gel transition at physiological temperature of 37°C without external curing agents. The bioadhesive provides dual-mechanism tissue bonding through physical adhesion via UPy hydrogen bonding and biological adhesion via integrin binding. [Figure 1]
Disclaimer: Curated by HT Syndication.
