MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058714 A) filed by Henkel AG & Co. Kgaa on May 08, 2026, for Thermally Conductive Silicone Adhesive Composition.
Inventors include Zhu, Xingyu; Xie, Dan; Chen, Xiaodan; and Chen, Yan.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: The present invention relates to a thermally conductive silicone adhesive composition comprising: (A) an alkenyl group-containing organopolysiloxane; (B) an alkyl group-terminated organopolysiloxane; (C) a silane coupling agent; (D) a catalyst; and (E) a mixture of (e-1) alumina having a D50 particle size of 4 to 8µm, (e-2) silicon carbide having a D50 particle size of 1 to 4µm, and (e-3) alumina and/or zinc oxide having a D50 particle size less than 1µm. The thermally conductive silicone adhesive composition exhibits a low thermal impedance, a low viscosity which is suitable for printing process, a high breakdown voltage, and a good anti-pump-out performance.
Disclaimer: Curated by HT Syndication.
