MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617071250 A) filed by Dow Global Technologies LLC on June 08, 2026, for Thermally Conductive Gap Filler Compositions With Storage Stability.
Inventors include Agarwal, Praveen; Gamboa, Rogelio; and Diaz, Omar.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: Thermally conductive compositions may include: an isocyanate component containing a blocked isocyanate; an isocyanate-reactive component containing: one or more polyetheramines and one or more magnesium oxide particles; and one or more thermally conductive fillers present in one or more of the isocyanate component and the isocyanate-reactive component; wherein the thermally conductive composition has a thermal conductivity of greater than 1 W/m.K. Methods may include combining an isocyanate component and an isocyanate-reactive component; and emplacing the resulting thermally conductive composition between a heat source and a heat sink in an EV battery.
Disclaimer: Curated by HT Syndication.
