MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647101975 A) filed by Borgwarner Inc. on August 24, 2026, for Thermal Energy Transfer Assembly And Method Of Making The Same.
Inventor includes O'Connor, Kurt F..
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A thermal energy transfer assembly includes a substrate made of a first material which has a first thermal conductivity coefficient, the substrate having a first surface and a second surface which is opposed to the first surface. The thermal energy transfer assembly also includes a thermal energy transfer element made of a second material having a second thermal conductivity coefficient which is greater than the first thermal conductivity coefficient. The thermal energy transfer element is applied to the first surface using additive friction stir deposition and extends into the substrate toward the second surface. The thermal energy transfer element and the substrate meet together in a stir zone which includes a mixture of both the first material and the second material.
Disclaimer: Curated by HT Syndication.
