MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202511014736 A) filed by Schneider Electric India Private Limited on February 20, 2025, for Thermal Assembly For Miniature Circuit Breakers (mcbs).
Inventors include Sheth, Rushikesh; Pothana, Santhosh; and Mohanty, Ashutosh.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present disclosure relates to a thermal assembly (100) for a miniature circuit breaker (MCB), the thermal assembly (100) includes a bimetallic strip (104) accommodated in a housing of the MCB, configured to exhibit thermal responsiveness to overcurrent conditions. An arc runner (102) coupled to the bimetallic strip in a perpendicular orientation at a junction point, wherein the arc runner (102) is oriented horizontally and extends outward from the junction point, wherein coupling between the arc runner (102) and the bimetallic strip (104) configured to facilitate conduction of current from the bimetallic strip to downstream circuit components and guide an electrical arc into an arc chute during circuit interruption, wherein the arc runner (102) operates as an outgoing terminal, reducing current path length and associated electrical resistance.
Disclaimer: Curated by HT Syndication.
