MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617060954 A) filed by Semitec Corporation on May 13, 2026, for Temperature Sensor And Device Equipped With Temperature Sensor.
Inventors include Ito Kenji; Shimazaki Daiki; and Jumonji Yuji.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Provided are a temperature sensor that has a planar heat-sensitive part and makes it possible to improve heat resistance and high-speed responsiveness, and a device equipped with the temperature sensor. The present invention is characterized by being provided with a substrate 2 formed from a glass material that does not cause phase transition within a use temperature range, at least a pair of thermistor electrode layers 3 formed on the substrate 2 and at least a pair of lead connection electrode layers 33 connected to the thermistor electrode layers, a thin-film resistance film 4 electrically connected to the at least one pair of thermistor electrode layers 3 formed on the substrate 2, a cover part that is composed of a glass material and covers the thin-film resistance film 4, and at least a pair of lead parts 8 electrically connected to the at least one pair of lead connection electrode layers 33. A planar first flat surface part 60 serving as a heat-sensitive part is formed on the substrate side, and a planar second flat surface part 50 serving as a heat-sensitive part is formed on the cover-part side.
Disclaimer: Curated by HT Syndication.
