MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202621052800 A) filed by Indian Institute Of Technology Bombay on April 25, 2026, for Temperature Responsive Patch.
Inventors include Srivastava, Rohit; Pawar, Vaishali Pundalik; Lancet, Renamala Steiney; and Soni, Vivek P.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The present invention relates to a temperature-responsive topical wound dressing with antimicrobial and analgesic properties for enhanced wound healing. The multi- layered, temperature-responsive wound dressing comprises i) two outer layers, said layers comprising a microcrystalline wax loaded with a non-steroidal anti- inflammatory drug, and ii) a middle gauge impregnated polymer sponge layer loaded with an antimicrobial active and sandwiched between said two outer layers. The wax enables controlled release of the analgesic at temperatures around 25°C, providing localized pain relief when activated by external cooling. The dressing maintains structural integrity in moist environments, demonstrates broad-spectrum antibacterial activity, and exhibits minimal swelling and degradation. The invention addresses the need for non-invasive, temperature-sensitive drug delivery in wound care and is particularly suitable for post-surgical and chronic wounds. It offers a cost-effective, multifunctional alternative to conventional dressings by combining infection control, moisture management, and targeted pain relief in a single application.
Disclaimer: Curated by HT Syndication.
