MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647109267 A) filed by Oracle International Corporation on September 11, 2026, for Techniques For Scaling A Reduced Footprint Data Center.
Inventors include Duffey, Laura, Ann; Assi, Anthony; Mohan, Mauruthi, Geetha; Zahedi, Shahab; and Taylor, Monty.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: Techniques are disclosed for scaling a reduced footprint data center. A networking device can be implemented at the reduced footprint data center and can include a plurality of networking ports. The networking device can be connected to a plurality of reduced footprint server racks using a first networking port of the plurality of networking ports. The plurality of reduced footprint data center server racks can be connected in a ring network and host a cloud service. An additional server rack can be connected to the networking device using a second networking port of the plurality of networking ports. A computing device of the additional server rack can be provisioned to host a portion of a data plane of the cloud service.
Disclaimer: Curated by HT Syndication.
