MUMBAI, India, Sept. 7 -- Intellectual Property India has published a patent application (202617046220 A) filed by Smiths Interconnect Americas, Inc. on April 10, 2026, for Systems And Methods For Coaxial Test Socket And Printed Circuit Board Interfaces.
Inventors include Elmadbouly, Khaled; and Zhou, Jiachun.
The application for the patent was published on September 04, 2026, under issue no. 36/2026.
Abstract: A test socket for coupling an IC chip to a PCB is provided. The test socket includes a conductive body having a first surface configured to face the PCB and a second surface configured to face the IC chip. The conductive body defines one or more cavities extending from the first surface to the second surface. The test socket further includes a first elastomer layer disposed between the first surface of the conductive body and the PCB. The first elastomer layer includes at least one first wire extending through the first elastomer layer and in electrical contact with the conductive body and with a ground conductor of the PCB. The first elastomer layer defines one or more first openings that align with the one or more cavities of the conductive body.
Disclaimer: Curated by HT Syndication.
