MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202647072470 A) filed by Meyer Burger Germany Gmbh on June 11, 2026, for System And Method For Vacuum Deposition.
Inventors include Holm, Niels; Barraud, Loris; and Lachenal, Damien.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: The invention relates to a layer deposition system, in particular for depositing at least one localised layer in a plasma-supported deposition system via a mask which partially shades a substrate, which in particular is a solar wafer, on a substrate carrier. The invention also relates to a method and a system for depositing a localised layer pattern on a wafer-like substrate in a vacuum deposition process. The invention contains a layer deposition system which is intended in particular for depositing at least one localised layer in a plasma-supported deposition system, wherein the layer deposition system contains a movable substrate carrier for receiving at least one solar wafer substrate, which is intended for transporting at least one substrate and at least one mask, which masks the substrate, between a charging station and a deposition station, wherein the movable substrate carrier and/or the mask has a magnetic field, wherein the substrate can be arranged on the substrate carrier, and the mask can be arranged on the substrate, precisely with respect to one another, and wherein the mask adheres magnetically as a result of the magnetic field.
Disclaimer: Curated by HT Syndication.
