MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202641116075 A) filed by Aditya University; Aditya College Of Pharmacy A; and Aditya Degree College on September 28, 2026, for System And Method For Transient Grounding Interface Monitoring And Active Electrode-Soil Boundary Restoration.
Inventors include Dr. Jagatpati Raiguru; Dr. C Rajasekhar Reddy; S. P. N. Kumar; and M. Janaki Ram.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The present disclosure proposes a system (100) and method for monitoring transient electrical coupling at a buried electrode-soil interface, detecting degradation from transient grounding-response characteristics and circumferential participation imbalance, selectively redistributing transient grounding participation, and restoring electrode-soil contact through piezoelectric actuation. The system (100) has a grounding electrode (102), a transient pulse injection circuit (108), a current sensing circuit (118), a voltage sensing circuit (120), a segmented conductive sleeve assembly (122), a sector-control arrangement (132), a piezoelectric restoration arrangement (140), a control unit (148), and a memory (152). The control unit (148) determines a First-Contact Displacement Boundary parameter and an Electrode-Soil Micro- Separation Onset parameter, confirms persistent interface degradation, controls circumferential transient current-spreading distribution, drives radial micro-vibration and circumferential micro-pressure, and re-evaluates transient responses to verify stabilization while maintaining the primary grounding path (106).
Disclaimer: Curated by HT Syndication.
