MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202611083725 A) filed by Manipal University Jaipur on July 07, 2026, for System And Method For Multi-Material Additive Manufacturing Using Hybrid Feedstocks And Controlled Thermal Processing.
Inventors include Dr. Santosh Kumar Rai; Dr. Gourav Kumar Sharma; and Dr. Nikhil Vivek Shrivas.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: The present invention relates to a System and Method for Multi-Material Additive Manufacturing Using Hybrid Feedstocks and Controlled Thermal Processing for Biomedical and Industrial Applications. The system (100) comprises dual induction heating coils (4,5) positioned along the extrusion pathway, enabling non-contact, rapid, and uniform heating of materials; electromagnetic flux control elements(25), along with thermocouples (23,24,26) at critical points including the nozzle (3) and induction zones, ensure precise thermal regulation suitable for high-temperature polymers and biocompatible materials; a ceramic alumina liner enhances thermal stability and material purity during processing; an advanced material conditioning subsystem comprising a dehumidification chamber with controlled air inlet (11) and outlet vents (14), spiral helix screw mechanism, and integrated humidity, temperature, and flow sensors; a fluid flow cooling assembly (6) and dedicated mounting structures to stabilize thermal gradients during operation; and Gaskets (9,12), heating elements (2), and modular mounting plates (10,22) provide sealing, insulation, and structural integrity across the extrusion unit. The invention provides an advanced additive manufacturing platform incorporating an XYZ axis gantry system (1) configured to support precise multi-directional deposition through a multi-head extrusion assembly. The disclosed system enables precise fabrication of complex, multi-material structures, including biomedical implants, tissue scaffolds, and industrial components, with enhanced control over material properties, temperature profiles, and environmental conditions, thereby improving print quality, reliability, and application versatility. Ref Fig no.1
Disclaimer: Curated by HT Syndication.
