MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202621098880 A) filed by Mamata Machinery Limited on August 15, 2026, for System And Method For Manufacturing Polymer-Based Multi-Layered Flexible Packaging Blown Film With Evoh Layer.
Inventor includes Babariya Mitulkumar Jasvantrai.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: SYSTEM AND METHOD FOR MANUFACTURING POLYMER-BASED MULTI-LAYERED FLEXIBLE PACKAGING BLOWN FILM WITH EVOH LAYER Abstract System (10) and method for manufacturing 40-80 microns polymer-based multi-layered flexible packaging blown film with 1.6-2.4 microns EVOH layer @250-550 kg/hr use air gap separated stackable die modules. Extruder (120) for the stackable die module (50) for the EVOH layer comprises a barrier screw (190) inside a barrel (200) divided into heating zones to maintain shear rate of the molten EVOH and residence time. Each half of the stackable module for the EVOH layer comprises a melt entry port half round channel that divides into multiple channels that end into spiral channels such that when the halves are assembled, cross-section of each channel resembles the shape of a capsule. Spiral channel transition zone (355) tapering towards the inside diameter (360) of the stackable die module, is formed. A diverging circular gap (375) formed ends into a circular gap (380) bending upwards and angularly rising forming an exit annular gap (385). Fig. 2 may accompany the Abstract.
Disclaimer: Curated by HT Syndication.
