MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617057743 A) filed by Daikin America, Inc.; and Daikin Industries, Ltd. on May 06, 2026, for System And Method For Forming Wire And Cable.
Inventors include Martin, Halie Jill; Orr, Matthew Philip; and Kenny, Robert.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: A system and method for manufacturing wire and cable products with a polymer cable component is provided. The systems and methods include increasing the hardness of a polymer cable component in order to reduce compression and deformation of the cable components during manufacturing. In some instances, the hardness is temporarily increased prior to or during the process of creating twisted pair or during the cabling process.
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