MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202611065144 A) filed by Ajoy Debbarma on May 23, 2026, for System And Method For Enhancing Convective Heat Transfer Using Periodically Modulated Magnetic Nanofluid Flow.
Inventor includes Ajoy Debbarma.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: The present invention relates to a system and method for enhancing convective heat transfer in electronic cooling applications using periodic magnetic field–induced modulation of nanoparticle transport in a circulating nanofluid. The disclosed system comprises a heated block (154) thermally coupled to a heat spreader (155), a flow channel (152) configured for circulation of a magnetically responsive nanofluid, a fluid circulation unit (120), one or more magnetic field generating units comprising iron cores (156) and copper coil (157) arrangements, and an electronic control unit (160) configured to generate dynamically modulated magnetic fields. During operation, the nanofluid is circulated through the flow channel (152) adjacent to the heated surface while the electronic control unit (160) periodically modulates electric current supplied to the magnetic field generating units. The generated time-varying magnetic field causes cyclic accumulation, concentration, and release of magnetic nanoparticles near the heat spreader (157) surface. The cyclic magnetic modulation disturbs the thermal boundary layer, induces localized flow perturbations and secondary flow structures, and enhances fluid mixing and energy transport within the flow channel (152). The disclosed system thereby improves convective heat transfer coefficient, temperature uniformity, and thermal transport efficiency compared to conventional passive cooling systems and static magnetic field arrangements. The invention is adaptable for use in mini-channel and microchannel cooling systems for processors, power electronic modules, battery thermal management systems, data centers, and other high heat flux electronic applications. The invention further provides a compact, controllable, scalable, and energy-efficient thermal management solution.
Disclaimer: Curated by HT Syndication.
