MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202644027299 A) filed by Nokia Technologies Oy on March 09, 2026, for Synchronisation Of Models.

Inventors include Rose, Luca; and Shehzad, Muhammad Karam.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: Certain examples of the disclosure provide a first node (101_1) of a network (100), the first node comprising: at least one processor (12); and at least one memory (13) including computer program code (14), the at least one memory storing instructions that, when executed by the at least one processor, cause the first node to perform at least the following: determining (401) one or more capabilities (421) of the first node, wherein the one or more capabilities of the first node comprises at least the following capabilities of the first node: receiving first information (431) and generating second information (432) based at least in part on the first information, wherein the second information comprises a reduced version of the first information; transmitting (402), towards the network, information (422) indicative of the determined one or more capabilities of the first node; receiving (404), from the network, at least one indication (423) of at least one node of the network selected to perform a procedure, wherein the at least one node is selected by the network based at least in part on the information indicative of the determined one or more capabilities of the first node; determining (405) whether the at least one selected node comprises the first node; performing, based at least in part on determining that the at least one selected node comprises the first node, the following: receiving (406) the first information; generating (407) the second information based at least in part on the first information, wherein the second information comprises a reduced version of the first information; and transmitting (408), towards at least one second node of the network, the second information. FIG. 4

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