MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202614015281 A) filed by Tanigurogumi Corporation on February 11, 2026, for Substrate Having Fine Through-Holes Filled With Metal And Manufacturing Method Thereof.
Inventor includes Watanabe, Genzo -.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A substrate having a plurality of fine through-holes filled with metal, comprising a conductive layer formed on an inner wall surface of each through- hole and a metal solder layer formed by solidification of a nickel-containing molten solder that has been treated with an organic fatty acid-containing solution. The conductive layer includes a copper plating layer on the metal solder layer side. An intermetallic compound layer that suppresses copper dissolution is formed at the interface between the copper plating layer and the metal solder layer. The substrate is preferably a glass or quartz substrate. Also provided is a manufacturing method thereof.
Disclaimer: Curated by HT Syndication.
