MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202617081698 A) filed by Cxmt Corporation on July 02, 2026, for Stepped Structure And Manufacturing Method Therefor, And Semiconductor Structure.
Inventor includes Wang, Hong.
The application for the patent was published on August 28, 2026, under issue no. 35/2026.
Abstract: A stepped structure and a manufacturing method therefor, and a semiconductor structure. The stepped structure comprises: a plurality of conductive layers arranged at intervals in a first direction, each conductive layer comprising at least two sub-conductive layers arranged at intervals in a second direction, and the conductive layers extending in a third direction; and a plurality of step structures arranged at intervals in the second direction, a column of the sub-conductive layers arranged at intervals in the first direction being at least in contact with and connected to one of the step structures. Each step structure comprises a plurality of conductive columns electrically insulated from one other, one of the conductive columns is in contact with and connected to one of the sub-conductive layers, and the conductive column in contact with and connected to said sub- conductive layer is electrically insulated from all of the other sub-conductive layers. In a column of the conductive layers arranged at intervals in the first direction, the conductive layers are in contact with and connected to the conductive columns one-to-one. Embodiments of the present disclosure at least facilitate reducing the horizontal area occupied by the whole stepped structure and increasing the integration density of the conductive columns in the stepped structure.
Disclaimer: Curated by HT Syndication.
