MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202647106820 A) filed by Yanyang New Energy Suzhou Co. , Ltd. on September 04, 2026, for Steel Stencil Used For Printing And Manufacturing Method Therefor.
Inventor includes Wu, Lianxiang.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: A steel stencil used for printing and a manufacturing method therefor, wherein the steel stencil comprises a metal layer (100) and at least two cushion layers (200) that are sequentially stacked, and the hardness of each cushion layer is lower than that of a substrate; a plurality of first fine-grid apertures (110) run through the metal layer; and a plurality of second fine-grid apertures (210) run through each cushion layer, the plurality of second fine-grid apertures on different layers are arranged in one-to- one correspondence, and the plurality of first fine-grid apertures and the plurality of second fine-grid apertures are arranged in one-to-one correspondence. The steel stencil can prevent partial indentation or microcracks of an OTO layer on the surface of a silicon wafer during printing.
Disclaimer: Curated by HT Syndication.
