MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647109028 A) filed by Toray Industries, Inc. on September 11, 2026, for Spun-Bonded Nonwoven Fabric, Laminated Nonwoven Fabric, Pleated Body, Dust-Collecting Filter, And Dust-Collecting Device.
Inventors include Murai Kota; Takemitsu Hiroki; and Nakano Yohei.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The present invention addresses the problem of providing a spun-bonded nonwoven fabric which, in addition to having a high collection performance (low pressure-loss and high collection-efficiency) and high air permeability, exhibits high pleat processability. The spun-bonded nonwoven fabric is composed of a composite fiber. The composite fiber includes a polypropylene-based resin P1 and a polypropylene-based resin P2 having a melting point Tm2 (°C) which is lower than the melting point Tm1 (°C) of the polypropylene-based resin P1 by 20°C or more and 60°C or less. The apparent density of the spun-bonded nonwoven fabric is 0.10 g/cm3 or more and 0.20 g/cm3 or less, and the bending resistance per unit basis weight in the vertical direction of the spun-bonded nonwoven fabric is 1.5 mg/(g/m2) or more and 10.0 mg/(g/m2) or less.
Disclaimer: Curated by HT Syndication.