MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617059149 A) filed by Dowa Electronics Materials Co. , Ltd. on May 09, 2026, for Spherical Silver Powder And Method For Producing Spherical Silver Powder.
Inventors include Nakanoya Taro; and Gotou Kimika.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: The purpose of the present invention is to provide a spherical silver powder that can impart an excellent thin line printability to conductive pastes. The present invention is a spherical silver powder in which a surface treatment agent is present; for which, in measurement of the thermal expansion coefficient, the maximum value of the thermal expansion coefficient with reference to the value at 50°C is 0.3% or less; for which the BET specific surface area is at least 0.1 m2/g and not more than 0.8 m2/g; and for which the value of D90 is at least 2.0 µm and not more than 4.0 µm.
Disclaimer: Curated by HT Syndication.
