MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617091493 A) filed by Greensource Fabrication LLC on July 28, 2026, for Solvent Free Copper Extraction.
Inventor includes Lovejoy, Derek.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: The system and method described herein provides for using ion-exchange resins to remove excess copper during processes such as PCB (Printed Circuit Board) fabrication using cupric chloride etchants. Cu+2 is used to oxidize solid copper producing two Cu+ ions. During operation, the etchant is overloaded with copper ions and an extraction system is implemented to control the concentration and remove excess copper. Traditional systems use liquid extractions but these systems can be costly and use hazardous solvents. Ion-exchange resins serve as a solution for controlling the concentration, absorbing metal ions and retaining them until desorption. The system and method further determines effectiveness of the resin in removing the copper based on performing adsorption and desorption at varying flow rates. Results showed that the resin effectively removes copper at various flowrates, removing an average of 10.06 g/l Cu from a bulk value of three beds of etchant.
Disclaimer: Curated by HT Syndication.
