MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202617076132 A) filed by Agc Inc. on June 19, 2026, for Solid Matter, Composition, And Molded Body.
Inventors include Taguchi Daisuke; Toyoda Mizuna; and Yanagawa Haruki.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present invention addresses the problem of providing: a solid matter having excellent crushability; a composition including the solid matter; a molded body obtained by molding the solid matter; and a molded body obtained by molding the composition. A solid matter according to the present invention comprises: a copolymer including a unit based on tetrafluoroethylene, a unit based on ethylene, and a unit based on a specific compound selected from the group consisting of compounds represented by formula (1) CX12=CX2(CF2)mF and compounds represented by formula (2) CF2=CF-O-(CF2)nF; said specific compound; and a solvent. The solvent includes a fluorine-containing solvent including a hydrogen atom and a fluorine atom and optionally having an ether bond. The fluorine-containing solvent contains a hydrofluorocarbon having a group represented by formula (3) CF3(CF2)p-*. The proportion of the total contained amount of the hydrofluorocarbon and the specific compound with respect to the total contained amount of the solvent and the specific compound is 90.0 mass% or less.
Disclaimer: Curated by HT Syndication.
