MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617079102 A) filed by Alpha Assembly Solutions Inc. on June 26, 2026, for Solder Joint Comprising A Tin Alloy And An Encapsulant Comprising Silica Particles In An Epoxy Resin, And Electronic Device.
Inventors include Choudhury, Pritha; Ribas, Morgana; Rangaraju, Raghu R.; Augustine, Prathap; Sarkar, Siuli; Lifton, Anna; and Yang, Hyunkwan.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: A solder joint at least partially encapsulated with an encapsulant, wherein the solder joint comprises a tin alloy; the encapsulant comprises silica particles dispersed in an epoxy resin; and the tin alloy comprises: from 2.8 to 4.5 wt.% silver, from 2.8 to 4 wt.% bismuth, from 1.0 to 6.5 wt.% antimony, from 0.3 to 1.2 wt.% copper, from 0.001 to 0.4 wt.% nickel, from 0.001 to 0.3 wt.% titanium, and the balance tin together with unavoidable impurities.
Disclaimer: Curated by HT Syndication.
