MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617079101 A) filed by Senju Metal Industry Co. , Ltd. on June 26, 2026, for Solder Alloy, Solder Ball, Solder Paste, And Soldered Joint.
Inventors include Yokoyama Takahiro; Yoshikawa Shunsaku; and Sugisawa Kota.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Provided are a solder alloy, a solder paste, a solder ball, and a soldered joint having excellent heat cycle resistance and drop impact resistance, and excelling in mounting properties by suppressing non-fusion, tombstoning, and discoloration. The solder alloy has an alloy composition comprising 0.8-2.5% Ag, 0.10-1.00% Cu, 0.03-0.07% Ni, 0.006-0.014% Ge, and 0.001-0.030% Co, with the remainder being Sn. Preferably, the alloy composition further contains, in terms of mass%, at least one of Ga, As, Pd, Mn, In, Zn, Zr, and Mg at an amount of 0.1% or less in total.
Disclaimer: Curated by HT Syndication.
