MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202641108186 A) filed by Pragati Engineering College on September 09, 2026, for Smart Soldering Station With Ai Temperature Control.
Inventors include Mrs. Tejasvi Teeparthi; Mr. G. Vijaya Kumar; Mrs. P. Ramya Krishna; and Dr. Vemuri Sailaja.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: The present invention relates to the field of electronics manufacturing, embedded systems, Artificial Intelligence (AI), and smart soldering technologies, and more particularly to a Smart Soldering Station with AI Temperature Control. The invention provides an intelligent soldering system capable of automatically monitoring and regulating the soldering temperature based on real-time operating conditions. The proposed system comprises a soldering iron with a heating element, temperature sensors, a heater control circuit, an embedded microcontroller, an AI-based adaptive temperature control algorithm, a display unit, and a wireless communication module. The AI algorithm continuously analyses soldering tip temperature, heater current, ambient temperature, and soldering duration to predict the optimum operating temperature and automatically regulate heater power for efficient soldering. The invention further incorporates intelligent soldering tip health monitoring, automatic sleep and standby modes, predictive maintenance alerts, real-time data logging, and wireless communication through Wi-Fi or Bluetooth for remote monitoring and performance analysis. Compared to conventional soldering stations that rely on manual temperature settings or fixed PID control, the proposed invention improves solder joint quality, minimizes overheating of electronic components, extends soldering tip life, reduces energy consumption, and decreases operator dependency. The invention provides a compact, intelligent, reliable, and cost-effective soldering solution suitable for electronics manufacturing industries, PCB assembly, repair and service centers, research laboratories, technical training institutes, and educational institutions. The proposed system enhances soldering accuracy, operational efficiency, equipment lifespan, and overall productivity while supporting modern smart manufacturing applications.
Disclaimer: Curated by HT Syndication.
