MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202611093426 A) filed by Chitkara University on July 31, 2026, for Smart Non-Adhesive Pre-Pain Prediction Patch For Infants Under Two Years.
Inventors include Dr. Shiwali Sharma; Dr. Narinder Pal Kaur; Utsav Kumar; Saksham Kumar Singh; Rohan Saxena; and Owais Faiyaz.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: ABSTRACT SMART NON-ADHESIVE PRE-PAIN PREDICTION PATCH FOR INFANTS UNDER TWO YEARS The present disclosure discloses a smart non- adhesive pre-pain prediction patch for infants under two years of age(100) The patch comprises protective silicone cover (102), a rechargeable battery (104), an AI prediction processor (106), a microcontroller unit (108), a wireless communication module (110), a temperature sensing module (112), a nerve signal sensing module (114), a sweat biomarker sensing module (116), an electrodermal electrode array (118), a sweat cortisol/pH nano-sensor (120), a skin-contact conformal interface (122), and a non-adhesive vacuum-fit retention structure (124). The sensing modules continuously acquire physiological data including skin temperature, electrodermal stress responses, and sweat biomarkers. The AI prediction processor (106) analyzes the acquired data to identify pre-pain physiological patterns, generate a pain risk score, and predict impending pain events prior to onset of crying or visible distress, thereby enabling timely caregiver intervention through wireless alerts. Reference
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