MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202641068343 A) filed by Takshashila University on June 01, 2026, for Smart Microneedle Based Adaptive Patch For Targeted Corn Removal With Pressure Responsive Controlled Drug Delivery System.
Inventors include Rajeshkumar. K; B. Sharmila; Dr. K. Puviyarasi; and M. Vasanthkumar.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: The titled invention discloses a smart microneedle-based adaptive patch for the treatment of corns. The system comprises biodegradable microneedles (4) for direct penetration into the corn core, a multi-layer drug reservoir (3) containing keratolytic (3a), anti-inflammatory (3b), and healing agents (3c), and a pressure-responsive sensor (5) system for controlled drug release. The patch ensures targeted delivery, minimizes damage to surrounding tissues, and provides condition-based therapy. The invention offers a minimally invasive, efficient, and intelligent solution for corn removal with improved safety and therapeutic effectiveness.
Disclaimer: Curated by HT Syndication.
