MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202641113863 A) filed by Sri Venkateswara College Of Engineering & Technology on September 23, 2026, for Smart Cooling And Thermal Management System For Data Centres.
Inventors include Dr. A. Mahamani; S. Muthukumar; M. Nabathi; Dr. D. Dhayalan; P. Tirumurugan; K. Sunitha; D. Bhuvaneswari; M. S. Sathish Kumar; M. Devi Priya; Dr. V. L. Nirmal Bhargavi; K. Eshrath; and A. Haritha.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The present invention relates to an integrated intelligent cooling system and device for predictive thermal management of data centres. It comprises a Thermal-Aware Workload Co-Scheduler (TAWCS) receives workload characteristics including workload type, expected power consumption, execution time, and rack location for predicting thermal load and initiating pre-emptive cooling before workload execution. A Data Centre Infrastructure Management (DCIM) and Building Management System (BMS) interface enables bidirectional communication between the workload scheduler and cooling infrastructure for coordinated thermal control. A machine learning-based adaptive cooling optimization unit continuously learns workload behaviour and thermal patterns to predict• future cooling demands and dynamically optimize airflow distribution and cooling resources. A smart rack-mountable blanking panel (101) comprising a shape-memory polymer (SMP) foam, a shape-memory alloy (SMA)-based self-sealing mechanism, and an airflow containment structure minimizes bypass airflow and hot-air recirculation within server racks. A sensor network including differential pressure sensors (303), thermopile heat flux sensors (301), temperature sensors, and piezoelectric sensors (302) continuously monitors airflow, pressure, heat flux, temperature distribution, and equipment health. A rack gateway generates real-time airflow topology maps and communicates the information to an intelligent monitoring platform for optimized cooling control. An extreme-condition notification module detects abnormal thermal and operational conditions and automatically transmits alerts with diagnostic information. The integrated platform improves cooling efficiency, reduces energy consumption, minimizes thermal hotspots, enhances Power Usage Effectiveness (PUE), supports higher rack densities, and increases data centre reliability (Figure 1).
Disclaimer: Curated by HT Syndication.
