MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202611087154 A) filed by Uttaranchal University on July 16, 2026, for Smart Circular Material Credit System.
Inventors include Siddharth Swami; Nishtha Dhiman; Dharam Buddhi; Shalini Goyal Bhalla; and Manmohan Singh Rawat.
The application for the patent was published on September 11, 2026, under issue no. 37/2026.
Abstract: A smart circular material credit system (SCMCS) utilizes a distributed digital and physical architecture to quantify, validate, and monetize circular economy practices in real time. The system is structured with an input layer comprising IoT-enabled sensors, industrial data streams, and material tracking inputs to monitor material flows, waste diversion rates, and product lifecycle extensions. A processing layer, featuring an AI-based validation engine, executes automated anomaly detection to prevent fraudulent claims and runs a circular metric computation module that applies quality, loop-benefit, and additionality factors to physical metrics to compute circular material units (). A machine-learning taxonomy engine standardizes these metrics across heterogeneous sectors and aligns them with global sustainability benchmarks. A blockchain layer utilizes smart contracts to automate the secure generation, trading, and permanent retirement of the units as unique, tamper-proof assets on a decentralized ledger. The system further incorporates a tokenization module for fractional trading, AI-driven market-pricing models, and integration interfaces for digital product passports and external environmental registries, turning verified circular practices into liquid, tradeable environmental assets that bridge ecological responsibility with financial incentive structures.
Disclaimer: Curated by HT Syndication.
