MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202618083477 A) filed by Corning Incorporated on July 07, 2026, for Single-Mode Optical Fiber With Thin Coating For High Density Cables And Interconnects.
Inventors include Bickham, Scott Robertson; Drake, Matthew Ryan; Hart, Shandon Dee; Li, Ming-Jun; Mccarthy, Joseph Edward; Niu, Weijun Filed On; and Tandon, Pushkar.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: An optical fiber comprising: a core region; a cladding region surrounding the core region, the cladding region comprising: an inner cladding directly adjacent to the core region, and an outer cladding surrounding the inner cladding; and a polymer coating having a thickness of 25 um or less, wherein the polymer coating comprises one of: (i) a high-modulus coating layer surrounding the cladding region, wherein the high-modulus coating layer has a Young’s modulus of 0.5 GPa or greater, or (ii) a low- modulus coating layer surrounding the cladding region, wherein the lowmodulus coating layer has a Young’s modulus of 5 MPa or less and is disposed between the cladding region and the high-modulus coating layer, wherein an outer diameter of the coated optical fiber is less than or equal to 175 microns.
Disclaimer: Curated by HT Syndication.
