MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617086232 A) filed by Tanaka Electronics Co. , Ltd. on July 14, 2026, for Silver Alloy Wire, And Conductive Wire, Wire For Joining, Wire For Semiconductor, And Wire For Structure Using Same.
Inventors include Chen Wei; Takeda Hideyuki; and Mikami Michitaka.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: Provided is a silver alloy wire that has high tensile strength and that, due to having high resistance against grain boundary deterioration, is able to maintain high strength as an industrial wire even at high temperatures. The silver alloy wire contains not less than 99.8 mass% silver, wherein, in a cross-section perpendicular to the lengthwise direction of the silver alloy wire, the ratio of a special grain boundary length of crystal grains is not less than 30%, and among lengthwise direction crystal orientations hkl measured in the cross-section, the ratio of crystal orientations 111 having an angle difference of not more than 15 degrees with respect to the lengthwise direction of the silver alloy wire is 10-60%.
Disclaimer: Curated by HT Syndication.
